Capabilities

Metrology

  • 3D Tomography (ALS APS)
  • Surface Reflectrometry
  • New tools and approaches to measuring advanced materials
    • Ultra-thin materials (charge in <1nm thick oxides)
    • Quantum devices
    • Ultra-low contamination levels
  • Combine high resolution characterization, fundamental modeling, and machine learning
  • 3D metrology
  • Sample and 300 mm wafer compatibility

Nano Fabrication

  • ORNL (Olga’s team)
  • CXRO/EUV
  • MesaFab
  • including materials and metrology
  • Sources (free electron laser, plasma physics)

Materials Synthesis

  • Molecular Foundry
  • What other NanoHubs?
  • Electrical contacts
  • Neuromorphic, quantum, …
  • Heterogeneous integration, 2.5D/3D
  • Lithographic materials
    • Fundamental work required in polymer science and radation chemistry
  • Leverage ab-initio modeling and machine learning for device and lithography materials

Simulation

  • Materials
  • Architectures
  • Devices
  • Full eco-system co-design: software, architecture, device, materials, and manufacturing
    • Manufacturing variablity
  • Programming methos for novel devices/architectures (Non Von Neumann)
  • Neo-analog/Analog-Digital systems
  • Hardware demonstraction units for testing/education